Job Description

Overview:

Join a pioneering team focused on advancing the frontiers of photonics and optical system integration. Our client is an innovative, growth-stage company developing next-generation optical platforms for high-impact applications.

Role & Responsibilities:

• Lead the development and optimization of advanced packaging solutions for photonic devices, including design, process integration, and reliability testing.
• Collaborate cross-functionally with internal R&D, product development, and external manufacturing partners to deliver packaged optical modules to market.
• Drive technical problem-solving related to photonic packaging, including materials selection, thermal management, mechanical robustness, and optical integrity.
• Oversee external supplier and contract manufacturer (OSAT) relationships, including qualification, process development, and yield improvement initiatives.
• Support DFM (Design for Manufacturing), prototyping, and transition to high-volume manufacturing.
• Contribute to technical strategy discussions influencing future product architectures and technology roadmaps.
• Mentor junior engineers and support a culture of innovation and technical excellence.

Qualifications:

• Advanced degree (MSc/PhD preferred) in Photonics, Materials Science, Physics, Electrical Engineering, or a related field.
• 8+ years of experience in photonics or optoelectronics, with a strong focus on packaging engineering and module integration.
• Demonstrated track record of leading packaging design projects or managing complex programs in an industrial setting.
• Experience partnering with contract manufacturers or OSATs for packaging development and production.
• Solid understanding of optical, mechanical, and thermal considerations in photonic module/package design.
• Hands-on proficiency with prototyping, reliability testing, and quality control processes.
• Excellent communication and cross-functional collaboration skills.

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